What is the CPU Power Zone? The CPU Power Zone contains the various components of a motherboard that are responsible for delivering power to the CPU (PWM controller, MOSFET Drivers, High and Low side MOSFETs, Chokes, Capacitors and related circuitry). What is a MOSFET? A MOSFET is one of the most critical components of the CPU power zone, as it is a switch that first allows or disallows electric current to flow to the CPU. Its switching is controlled by the MOSFET driver and PWM controller.

GIGABYTE UNITED INC., a leading manufacturer of motherboards and graphics cards today is pleased to introduce their revolutionary Ultra Durable 3 technology, the. GIGABYTE Ultra Durable™ 3 series motherboards once again lead the motherboard industry for the highest quality and most innovative motherboard design. Featuring the industry's first consumer desktop motherboard design to introduce 2 ounces of copper for both the Power and Ground layers, GIGABYTE Ultra. Gigabyte EP45-UD3P Ultra Durable 3. Motherboard Revision: 1.0 BIOS Version: F5. We received an EP45-UD3P motherboard from Gigabyte to perform our testing and. Gigabyte GA-EP45-UD3P Ultra Durable 3 Motherboard. At one of the motherboards from Gigabyte's new Ultra Durable 3. Drivers and applications arrive on a.

It is also one of the most expensive components of the power design. What is a Power Stage? A Power Stage is a single chip that includes the MOSFET driver, 1 high side MOSFET and 2 (or sometimes 1) Low Side MOSFETs. Power Stages are made using a more advanced manufacturing process, and are therefore more efficient. What is a Traditional MOSFET (Also known as D-Pak MOSFET.)? A Traditional MOSFET is a less advanced MOSFET design that is used in a traditional CPU power zone where the MOSFET drivers and High and Low Side MOSFETS are each individual chips (multi-chip MOSFET design).

They are less expensive and less efficient than single chip Power Stages. IR3550 PowIRstage ® ICs remain cooler than other MOSFET designs, allowing users to overclock to greater levels of performance. Each power component has a maximum thermal operational temperature, and once it is reached, adding more voltage will only result in a failed overclock. Since IR3550 PowIRstages ® are able to operate at cooler temperatures at higher voltages than traditional designs, overclockers are able to have more headroom to increase voltages, resulting in higher potential overclocks.

Not enough power for overclocking 2X Copper PCB GIGABYTE Ultra Durable™ 4 design features 2X the amount of copper of a traditional motherboard for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. GIGABYTE's Ultra Durable™ 4 also lowers the PCB impedance by 50%, which helps to reduce electrical waste and further lowers component temperatures. A 2X Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference), providing better system stability and allowing for greater margins for overclocking.

Electron Electron In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable 3 motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality, providing better system stability and allowing for greater margins for overclocking. Transformers Fall Of Cybertron Language Patch + Crack Fix more. A good PCB circuit layout is the key of controlling EMI emission.